banner
Products
Home Ultrasonic Machining

Ultrasonic Milling

Ultrasonic Grinding Connect CNC Processing Semiconductor Ceramics

Ultrasonic Grinding Connect CNC Processing Semiconductor Ceramics

The excellent ultrasonic control technology can ensure the stability of long-term machining. Frequency scanning and power setting can be completed automatically by controller to improve productivity.

  • Item No.:

    HS-M20
  • Payment:

    T/T, PayPal, West Union
  • Product origin:

    China
  • Color:

    Silver and Green
  • Shipping port:

    Shanghai or Ningbo
  • Lead Time:

    45
  • Product Details


Ultrasonic Grinding Connect CNC Processing Semiconductor Ceramics



Specification:


Item No.: HS-M20

Frequency: 20kHz

Power: 500Watt

Speed: 20,000RPM

Amplitude: 10um or more

Diameter of Horn: 

                          Milling: Φ1-Ф13mm

                          Drilling:Ф2-Ф6mm

Spindle: BT40 / BT50 / R8 / HSK63 / ISO / CAT

(Special spindles are made per request.)



Description: 


Rotary ultrasonic-assisted machining is a new processing technology obtained by combining traditional machining and ultrasonic machining. Compared with traditional machining, rotary ultrasonic assisted machining has the advantages of low cutting force, low cutting heat, high machining accuracy and high processing efficiency, and is widely used in hard and brittle materials such as single crystal silicon, engineering ceramics, cemented carbide, and composite materials such as carbon fiber. Processing, has broad application prospects.



Advantage:


1. The excellent ultrasonic control technology can ensure the stability of long-term machining. Frequency scanning and power setting can be completed automatically by controller to improve productivity.

2. Periodical tool axial vibration decreases the cutting resistance and increases the surface quality.

3. Modular design, equipped with high speed spindle, allows high efficiency machining.

4. Coolant through spindle is available for chip disposal and to reduce tool wear caused by temperature rise and cutting resistance.

5. The roughness of metal cutting surface is around Ra 0.2 µm, it reduces the polishing procedure and achieves the quality of final finishing.

6. The ultrasonic machining technology not only reduces chipping but also has the ability to process micropore machining on hard and brittle materials.



Application:


1.Tight-tolerance round thru-holes for semiconductor processing equipment components

2.Micromachined and micro-structured glass wafers for microelectromechanical systems (MEMS) applications

3.High-aspect ratio thru-vias; 60-to-1 aspect ratios are possible in glass and advanced material

4.Features machined into Ceramic Matrix Composites for Aerospace manufacturing



1(1)3(1)


Leave A Message

If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

related products
Ultrasonic Rotary Spindle
None-contact Ultrasonic Drilling for Zirconic Glass Yttria Aluminum Nitride and Semiconductor Ceramics

The excellent ultrasonic control technology can ensure the stability of long-term machining. Frequency scanning and power setting can be completed automatically by controller to improve productivity. The tool oscillates at a frequency of approximately 20 kHz by a piezoelectric sensor and an electric oscillator. The tool forces the abrasive grit to normally impact the work surface in the gap between the tool and the workpiece to machine the work surface.

ultrasonic milling
Ultrasonic Assisted Milling With BT50 Tool Holder

It works in the same way as ultrasonic welding. This process uses ultrasonic waves to generate low-amplitude high-frequency forces that act as a driving force for the abrasive. This high frequency vibration transfer to the abrasive particles is contained in the abrasive slurry. This causes the abrasive particles to be indented to the brittle workpiece and removed from the contact surface.

Ultrasonic Drilling Process
Strong Anti-interference Rotary Ultrasonic Grinding for Titanium alloy and Tungsten Carbide

Ultrasonic Machining is a new mechanical machining process, which can enhance the milling and drilling performance by high frequency micro vibrations. 

Ultrasonic Milling Machine
precision milling process ultrasonic auxiliary system ultrasonic tool holder BT30/BT40/BT50

Ultrasonic milling equipment can be used for finishing of metal hard materials.

Ultrasonic Milling Machine
BT30/40/50 HSK63A CT40 ultrasonic spindle drilling and milling system metal finishing

Ultrasonic milling equipment can be used for finishing of metal hard materials.

ultrasonic assisted milling machine
Non-contact Ultrasonic Drilling Process for Yttria and Sapphire

Ultrasonic milling has proven to be an effective technique for improving titanium, aluminum and stainless steel workability. Under the action of ultrasonic milling, it has more advantage than the traditional milling. In contrast to the effect of ultrasonic machining aluminum, steel, stainless steel, titanium four metallic materials.Improved surface quality of the most prominent is the titanium and aluminum, can improve the cutting ability of the most prominent is the stainless steel, the quality of the workpiece side is the most significant improvement in steel. In addition, for steel quenching after nearly HRC60, the traditional tool is difficult of steel cutting and processing cost is high, only when its hardness is higher than the work piece tool HRC25 above to processing. However, on the basis of traditional tools added to ultrasound, can greatly reduce the cutting of cutting resistance and improve cutting surface quality, but also increase the service life of the tool at least doubled.

© Copyright: 2024 Hangzhou Altrasonic Technology Co.,Ltd All Rights Reserved

IPv6 network supported

top

Leave A Message

Leave A Message

    If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.